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Put simply, a liquid solution is deposited onto a spinning substrate in order to produce a thin film of solid material, such as a polymer. Spin coating generally involves the application of a thin film (a few nm to a few um) evenly across the surface of a substrate by coating (casting) a solution of the desired material in a solvent (an 'ink') while it is rotating. Ambient Conditions and Changes in Drying TimeĪvailable From £1900.00 Order Today Introduction to Spin Coating.Visible Assessment of Drying and Film Uniformity.Ultra-low Spin Speeds and Covered Drying.Special Requirements for Spin Coating Nanoparticles.This guide aims to introduce general spin coating concepts, cover spin coating equations and theory, and describe some of the specific techniques useful in organic electronics and nanotechnology.

The relatively thin films and high uniformity required for effective device preparation, as well as the need for self-assembly and organisation to occur during the casting process, do however necessitate some differences in method. The use of spin coating in organic electronics and nanotechnology is widespread and has built upon many of the techniques used in other semiconductor industries. Its primary advantage of spin coating over other methods is its ability to quickly and easily produce very uniform films. Spin coating is used in a wide variety of industries and technology sectors. After any remaining solvent has evaporated, spin coating results in a thin film ranging from a few nanometres to a few microns in thickness. When a solution of a material and a solvent is spun at high speeds, the centripetal force and the surface tension of the liquid together create an even covering. Spin coating is a common technique for applying thin films to substrates.

Spin Coating: Complete Guide to Theory and Techniques

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